Web Results

eepower.com/technical-articles/active-vibration-control-in-ultrasonic-wire-bonding-improving-bondability-on-demanding-surfaces

Dec 19, 2014 ... Continuously increasing machine speeds intensify this demand. Another challenge is bonding on demanding surfaces, like slim connector pins ...

www.freepatentsonline.com/5201450.html

Apr 13, 1993 ... The wire bonding machine is generally provided with a heat block for providing a bonding heat for the bonding portions between the opposite ...

aip.scitation.org/doi/10.1063/1.4867100

Thermosonic wire bonding has been most widely used as a first level ... ( electronic flame off) ball, the profile of the wire, and the motional stability of the machine.2. ... In ...

bondlab-qa.web.cern.ch/BondingIssues_Honma_Oct2015.pdf

Oct 14, 2015 ... Highly bonding specific technical issues (loop form, wire type, tool choice). ✦ Highly machine specific technical issues (feedback control, PR ...

vimeo.com/95597433

May 17, 2014 ... An automated wire bonding machine that connects bare silicon to a PCB as part of the chip on board (COB) process. Read the full tutorial here: ...

depositphotos.com/110293544/stock-photo-wire-bonding-machine-close-up.html

Download Wire bonding machine close up process, electrical interconnection of micro mechanic and electronic components, Ultrasonic wedge bonding image ...

www.123rf.com/photo_58943657_wire-bonding-machine-close-up-process-electrical-interconnection-of-micro-mechanic-and-electronic-co.html

Picture of Wire bonding machine close up process, electrical interconnection of micro mechanic and electronic components, Ultrasonic wedge bonding stock ...

www.qptechnologies.com/services/ic-assembly/wire-bonding

QP Technologies (formerly Quik-Pak) performs wire bonding utilizing the latest automatic wirebonding equipment from K&S and Hesse.

www.axend.biz/tpt

Typically wire bonding is performed from an integrated circuit to a substrate, but can also be from one electrically conductive point to another such as one ...

www.cwitechsales.com/wirebonding

HB05. Manual Wire Bonder. ​. Ideal for laboratories and pilot production lines. Wedge, Ball, Bump and Ribbon bonding. 17µ to 75µ Wire & 25µ x 250µ Ribbon.

www.tandfonline.com/doi/pdf/10.1080/10667857.2005.11753115?needAccess=true

wedge-wedge bonding is used. The second bond in the sequence is always a wedge bond. Wire bonding machines have used an ultrasonic frequency of 60kH  ...