Solder paste is used on a printed circuit board to attach the leads or mounts of integrated chips to designated points on the board. The solder paste is generally applied or dispensed with a tube to the leads with the use of a stencil. The solder is pasted to the circuit board, then heated to melt the paste. This process fuses the connection between the circuit board and the chip.
Soldering paste is a specific type of solder commonly used in printed circuit board or PCB assembly. The paste is printed directly on the surface of circuit boards. After the solder is heated, the paste melts and it enters the intricate spaces between adjacent parts. This allows the solder to create a soldered joint.
This paste is used in the mass production and assembly of standard PCBs and prototypes. Soldering paste creates a strong, soldered connection that is useful in the production of high-quality circuit boards. When using solder paste, there is a level of expertise and knowledge required to avoid over-saturating or under-saturating the solder. For most devices, there is a specific amount of solder paste required for specific parts. A mistake in the amount of solder can result in a malfunctioning device.