Process of coating with metal by means of an electric current. Plating metal may be transferred to conductive surfaces (e.g., metals) or to nonconductive surfaces (e.g., plastics, wood, leather) if a conductive coating has been applied. Usually the current deposits a given amount of metal on the cathode (workpiece) and the anode (source of metal) dissolves to the same extent, maintaining a fairly uniform solution. Silver plating is used on tableware, electrical contacts, and engine bearings. The most extensive use of gold plating is on jewelry and watch cases. Zinc coatings prevent the corrosion of steel articles, and nickel and chromium plate are used on automobiles and household appliances. Seealso terneplate, Sheffield plate.
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The process used in electroplating is called electrodeposition. It is analogous to a galvanic cell acting in reverse. The part to be plated is the cathode of the circuit. In one technique, the anode is made of the metal to be plated on the part. Both components are immersed in a solution called an electrolyte containing one or more dissolved metal salts as well as other ions that permit the flow of electricity. A rectifier supplies a direct current to the anode, oxidizing the metal molecules that comprise it and allowing them to dissolve in the solution. At the cathode, the dissolved metal ions in the electrolyte solution are reduced at the interface between the solution and the cathode, such that they "plate out" onto the cathode. The rate at which the anode is dissolved is equal to the rate at which the cathode is plated, vis-a-vis the current flowing through the circuit. In this manner, the ions in the electrolyte bath are continuously replenished by the anode.
Other electroplating processes may use a nonconsumable anode such as lead. In these techniques, ions of the metal to be plated must be periodically replenished in the bath as they are drawn out of the solution.
The anode and cathode in the electroplating cell are both connected to an external supply of direct current - a battery or, more commonly, a rectifier. The anode is connected to the positive terminal of the supply, and the cathode (article to be plated) is connected to the negative terminal. When the external power supply is switched on, the metal at the anode is oxidized from the zero valence state to form cations with a positive charge. These cations associate with the anions in the solution. The cations are reduced at the cathode to deposit in the metallic, zero valence state. For example, in an acid solution, copper is oxidized at the anode to Cu2+ by losing two electrons. The Cu2+ associates with the anion SO42- in the solution to form copper sulfate. At the cathode, the Cu2+ is reduced to metallic copper by gaining two electrons. The result is the effective transfer of copper from the anode source to a plate covering the cathode.
Many plating baths include cyanides of other metals (e.g., potassium cyanide) in addition to cyanides of the metal to be deposited. These free cyanides facilitate anode corrosion, help to maintain a constant metal ion level and contribute to conductivity. Additionally, non-metal chemicals such as carbonates and phosphates may be added to increase conductivity.
When plating is not desired on certain areas of the substrate, stop-offs are applied to prevent the bath from coming in contact with the substrate. Typical stop-offs include tape, foil, lacquers, and waxes.
The striking method is also used in combination with the plating of different metals. If it is desirable to plate one type of deposit onto a metal to improve corrosion resistance but this metal has inherently poor adhesion to the substrate, a strike can be first deposited that is compatible with both. One example of this situation is the poor adhesion of electrolytic nickel on zinc alloys, in which case a copper strike is used, which has good adherence to both.
While most plating cells use a continuous direct current, some employ a cycle of 8–15 seconds on followed by 1–3 seconds off. This technique is commonly referred to as "pulse plating" and allows high current densities to be used while still producing a quality deposit. In order to deal with the uneven plating rates that result from high current densities, the current is even sometimes reversed in a method known as "pulse-reverse plating", causing some of the plating from the thicker sections to re-enter the solution. In effect, this allows the "valleys" to be filled without over-plating the "peaks". This is common on rough parts or when a bright finish is required. In a typical pulse reverse operation, the reverse current density is three times greater than the forward current density and the reverse pulse width is less than one-quarter the forward pulse width. Pulse-reverse processes can be operated at a wide range of frequencies from several hundred hertz up to the order of megahertz.
Brush electroplating has several advantages over tank plating, including portability, ability to plate items that for some reason cannot be tank plated (one application was the plating of portions of very large decorative support columns in a building restoration), low or no masking requirements, and comparatively low plating solution volume requirements. Disadvantages compared to tank plating can include greater operator involvement (tank plating can frequently be done with minimal attention), and inability to achieve as great a plate thickness..
For example, an electroless process is used for electroless nickel plating.
Modern electrochemistry was invented by Italian chemist Luigi V. Brugnatelli in 1805. Brugnatelli used his colleague Alessandro Volta's invention of five years earlier, the voltaic pile, to facilitate the first electrodeposition. Brugnatelli's inventions were repressed by the French Academy of Sciences and did not become used in general industry for the following thirty years.
By 1839, scientists in Britain and Russia had independently devised metal deposition processes similar to Brugnatelli's for the copper electroplating of printing press plates. Soon after, John Wright of Birmingham, England discovered that potassium cyanide was a suitable electrolyte for gold and silver electroplating. Wright's associates, George Elkington and Henry Elkington were awarded the first patents for electroplating in 1840. These two then founded the electroplating industry in Birmingham from where it spread around the world.
As the science of electrochemistry grew, its relationship to the electroplating process became understood and other types of non-decorative metal electroplating processes were developed. Commercial electroplating of nickel, brass, tin, and zinc were developed by the 1850s. Electroplating baths and equipment based on the patents of the Elkingtons were scaled up to accommodate the plating of numerous large scale objects and for specific manufacturing and engineering applications.
The plating industry received a big boost from the advent of the development of electric generators in the late 19th century. With the higher currents, available metal machine components, hardware, and automotive parts requiring corrosion protection and enhanced wear properties, along with better appearance, could be processed in bulk.
The two World Wars and the growing aviation industry gave impetus to further developments and refinements including such processes as hard chromium plating, bronze alloy plating, sulfamate nickel plating, along with numerous other plating processes. Plating equipment evolved from manually operated tar-lined wooden tanks to automated equipment, capable of processing thousands of kilograms per hour of parts.
One of the American physicist Richard Feynman's first projects was to develop technology for electroplating metal onto plastic. Feynman developed the original idea of his friend into a successful invention, allowing his employer (and friend) to keep commercial promises he had made but could not have fulfilled otherwise.
Researchers Submit Patent Application, "Electroplating Jig for Processing Electroplating at Certain Location, Electroplating Method Incorporating with the Same, and Electro Product Free of Plating Pro
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