Dicing is a method of food preparation in which the food item is cut into small blocks or dice. This may be done for aesthetic, or artistic, reasons or to create uniformly sized pieces to ensure even cooking. Dicing is a desirable method of food preparation, due to the small nature of the pieces of food, which allows the spread of flavour and texture throughout the dish, as well as a somewhat faster cooking speed.
Technically there are three types of dicing: large, medium, and small. Large is usually a 3/4 in. cube, medium 1/2 inch, and small 1/4 inch. However, in home cooking most people understand dicing to just be any size cube, often the size of a regular set of game dice.
Patent Issued for Dicing Tape-Integrated Film for Semiconductor Back Surface, and Process for Producing Semiconductor Device
Jun 19, 2013; By a News Reporter-Staff News Editor at Electronics Newsweekly -- Nitto Denko Corporation (Osaka, JP) has been issued patent...
Patent Application Titled "Dicing Tape-Integrated Film for Semiconductor Back Surface, and Process for Producing Semiconductor Device" under Review
Dec 05, 2012; By a News Reporter-Staff News Editor at Electronics Newsweekly -- According to news reporting originating from Washington, D.C.,...