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ENIG
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ENIG

ENIG
ENIG is an acronym for Electroless Nickel/Immersion Gold. It is a type of surface plating commonly used for Printed Circuit Boards.

Description

It consists of an Electroless nickel plating covered with a thin layer of immersion gold for protecting the nickel from oxidation.

Advantages of ENIG

  • Excellent surface planarity (compared to e.g. HASL)
  • Good oxidation resistance
  • Usable for untreated contact surfaces (e.g. membrane switches and contact points)

Disadvantages of ENIG

  • "Black Pad" reliability problem

Specifications

IPC Standard: IPC-4552

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Last updated on Wednesday March 05, 2008 at 09:20:30 PST (GMT -0800)
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Related Articles
Corrosion resistance of ENIG: an improved immersion gold process: to understand the impact of ENIG chemistry change on corrosion resistance of the immersion gold, this article investigates the relationship between immersion gold bath pH and chemistry and the resulting corrosion resistance of the immersion gold layer.(Electroless Nickel/ Immersion Gold)
Dec 01, 2003; Electroless Nickel/Immersion Gold (ENIG) has been relied upon as a durable, corrosion resistant surface finish in the...
Read more with a free trial on HighBeam.com »
Black pad on ENIG PCBS: the discovery of "extreme dewetting" prompted a search for the source--in Shenzhen.(Better Manufacturing)
Jul 01, 2007; Early in 2005, SMC formed a steering committee to discuss and define implementation of Pb-free and RoHS production capabilities...
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Wiping out "black pad": improved process control can help the ENIG process shine.(FINAL FINISH FORUM)
Mar 01, 2009; THERE ARETVVO KEYS to a successful black pad/nickel corrosion-free ENIG process. The nickel deposit should be tight and...
Read more with a free trial on HighBeam.com »
Successful Formulation of ENIG Plating: Results of a Two-Year Study of Various Electroless Nickel Baths
Aug 01, 2012; Many Pb-free alloy formulations, including SAC alloy (consisting of 3-4% silver, 0.5-1% copper and the balance tin), have been...
Read more with a free trial on HighBeam.com »
The characterization of Al bond pad surface treatment in electroless nickel immersion gold (ENIG) deposition.(Table)(Report)
Mar 01, 2007; INTRODUCTION Electroless nickel Immersion Gold (ENIG) as under bump metallurgy (UBM) of the bond pads on a silicon wafer...
Read more with a free trial on HighBeam.com »
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